ISL8560 View Datasheet(PDF) - Intersil

Part Name

Description

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ISL8560

DC/DC Power Switching Regulator

Intersil 

ISL8560

A multi-layer printed circuit board is recommended.

Figure 32 shows the connections of the critical components

in the converter. Note that capacitors CIN and COUT could

each represent numerous physical capacitors. Dedicate one

solid layer, usually a middle layer of the PC board, for a

ground plane and make all critical component ground

connections with vias to this layer. Dedicate another solid

layer as a power plane and break this plane into smaller

islands of common voltage levels. Keep the metal runs from

the LX terminals to the output inductor short. The power

plane should support the input power and output power

nodes. Use copper filled polygons on the top and bottom

circuit layers for the LX nodes. Use the remaining printed

circuit layers for small signal wiring.

In order to dissipate heat generated by the internal LDO and

other power components, the ground pad at the bottom of

the device should be connected to the ground plane through

at least nine vias. This allows the heat to move away from

the IC and also ties the pad to the ground plane through a

low impedance path.

The switching components should be placed close to the

ISL8560 first. Minimize the length of the connections

between the input capacitors, CIN. Make the PGND and the

output capacitors as short as possible.

NOTE: It is recommended that any applications with input

voltage greater than 30VDC should be polymer coated to

meet Intersil’s IPC-2221 creepage and clearance

specification.

16

FN9244.7

September 19, 2008

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