FSL136MR View Datasheet(PDF) - Fairchild Semiconductor
Part Name
Description
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FSL136MR Datasheet PDF : 13 Pages
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Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only. TJ = 25°C, unless otherwise specified.
Symbol
Parameter
Min.
Max.
Unit
VSTR
VSTR Pin Voltage
-0.3
650.0
V
VDS
Drain Pin Voltage
-0.3
650.0
V
VCC
Supply Voltage
26
V
VFB
Feedback Voltage Range
-0.3
12.0
V
ID
Continuous Drain Current
IDM
Drain Current Pulsed(4)
EAS
Single Pulsed Avalanche Energy(5)
3
A
12
A
230
mJ
PD
Total Power Dissipation
1.5
W
TJ
Operating Junction Temperature
Internally Limited
°C
TA
Operating Ambient Temperature
-40
+105
°C
TSTG
Storage Temperature
-55
+150
°C
Human Body Model, JESD22-A114(6)
5.0
ESD
Charged Device Model, JESD22-C101(6)
1.5
KV
ΘJA
Junction-to-Ambient Thermal Resistance(7,8)
ΘJC
Junction-to-Case Thermal Resistance(7,9)
ΘJT
Junction-to-Top Thermal Resistance(7,10)
80
°C/W
19
°C/W
33.7
°C/W
Notes:
4. Repetitive rating: pulse width limited by maximum junction temperature.
5. L=51mH, starting TJ=25°C.
6. Meets JEDEC standards JESD 22-A114 and JESD 22-C101.
7. All items are tested with the standards JESD 51-2 and JESD 51-10.
8. ΘJA free-standing, with no heat-sink, under natural convection.
9. ΘJC junction-to-lead thermal characteristics under ΘJA test condition. TC is measured on the source #7 pin closed
to plastic interface for ΘJA thermo-couple mounted on soldering.
10. ΘJT junction-to-top of thermal characteristic under ΘJA test condition. Tt is measured on top of package. Thermo-
couple is mounted in epoxy glue.
© 2009 Fairchild Semiconductor Corporation
FSL136MR • Rev. 1.0.7
4
www.fairchildsemi.com
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