MAX8830EWET(2007) View Datasheet(PDF) - Maxim Integrated
Part Name
Description
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MAX8830EWET Datasheet PDF : 15 Pages
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LED Light Management IC in
2.5mm x 2.5mm UCSP
ABSOLUTE MAXIMUM RATINGS
IN, OUT to GND………………………....…………..-0.3V to +6.0V
IN, OUT to GND (maximum of 1µs) ....................................+7.0V
VDD to GND ...........................................................-0.3V to +4.0V
SCL, SDA, MVON, FLEN to GND..................-0.3V to VDD + 0.3V
COMP, FLED, LED_ to GND .......................-0.3V to VOUT + 0.3V
PGND to GND .......................................................-0.3V to +0.3V
Continuous ILX Current...............................................600mARMS
Continuous Power Dissipation (TA = +70°C)
16-Bump 2.5mm x 2.5mm UCSP
(derate 105.7mW/°C above +70°C) .............................750mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Bump Temperature* (soldering) ......................................+235°C
*This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be
exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recommended in the
industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection reflow. Preheating is required.
Hand or wave soldering is not allowed.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VIN = 3.6V, VGND = VPGND = 0V, VDD = 3.0V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1)
PARAMETER
DESCRIPTION
MIN TYP MAX UNITS
IN Operating Voltage
2.7
5.5
V
VDD Operating Range
VDD Undervoltage Lockout (UVLO) Threshold
VDD UVLO Hysteresis
IN UVLO Threshold
IN UVLO Hysteresis
VDD falling
VIN rising
1.7
3.6
V
1.35
1.5
1.65
V
50
mV
2.25 2.45 2.65
V
50
mV
VDD Standby Supply Current
IN Standby Supply Current
IN Shutdown Supply Current
Thermal-Shutdown Hysteresis
SCL = SDA = VDD,
I2C ready
SCL = SDA = VDD,
I2C ready
All outputs off,
VDD = 0
TA = +25°C
TA = +85°C
TA = +25°C
TA = +85°C
TA = +25°C
TA = +85°C
3
10
µA
4
5
15
µA
5
0.1
5
µA
1
20
°C
Thermal-Shutdown
LOGIC AND I2C INTERFACE
+160
°C
Logic Input-High Voltage
Logic Input-Low Voltage
Logic Input Current
SDA Output Low Voltage
I2C Clock Frequency
VDD = 1.7V to 3.6V
MVON, FLEN
SCL, SDA
VDD = 1.7V to 3.6V
MVON, FLEN
SCL, SDA
VIL = 0V or VIH = 3.6V
ISDA = 3mA
TA = +25°C
TA = +85°C
1.6
0.7 x
V
VDD
0.4
0.3 x
V
VDD
-1
0.01
+1
µA
0.1
0.03
0.4
V
400
kHz
Bus-Free Time Between START and STOP
Hold Time Repeated START Condition
SCL Low Period
tBUF
tHD_STA
tLOW
1.3
µs
0.6
0.1
µs
1.3
0.2
µs
2 _______________________________________________________________________________________
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