FF300R12KE4P Datasheet - Infineon Technologies
Part Name
FF300R12KE4P
Other PDF
PDF
page
9 Pages
File Size
571.3 kB
MFG CO.
Infineon Technologies
Electrical Features
• Low switching losses
• Unbeatable robustness
• VCEsat with positive Temperature Coefficient
Mechanical Features
• Package with CTI > 400
• High creepage and clearance distances
• High Power density
• Isolated base plate
• Standard housing
• Pre-applied Thermal Interface Material
Typical Applications
• High power converters
• Motor drives
• UPS systems
• Wind turbines
Part Name
Description
PDF
MFG CO.
62mm C-Series module with Trench/Fieldstop IGBT4 and Emitter Controlled HE diode and pre-applied Thermal Interface Material
Infineon Technologies
62mm C-Series module with Trench/Fieldstop IGBT4 and Emitter Controlled HE diode and pre-applied Thermal Interface Material
Infineon Technologies
62mm C-Series module with Trench/Fieldstop IGBT4 and Emitter Controlled HE diode and pre-applied Thermal Interface Material
Infineon Technologies
62mm C-Series module with fast Trench/Fieldstop IGBT4 and Emitter Controlled HE diode and pre-applied Thermal Interface Material
Infineon Technologies
62mm C-Series module with Trench/Fieldstop IGBT4 and Emitter Controlled diode and pre-applied Thermal Interface Material
Infineon Technologies
62mm C-Series module with Trench/Fieldstop IGBT4 and Emitter Controlled diode and pre-applied Thermal Interface Material
Infineon Technologies
62mm C-Series module with Trench/Fieldstop IGBT3 and Emitter Controlled HE diode and pre-applied Thermal Interface Material
Infineon Technologies
62mm C-Series module with fast Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and pre-applied Thermal Interface Material
Infineon Technologies
62mm C-Series module with Trench/Fieldstop IGBT3 and Emitter Controlled HE diode and pre-applied Thermal Interface Material
Infineon Technologies
62mm C-Series module with Trench/Fieldstop IGBT3 and Emitter Controlled HE diode and pre-applied Thermal Interface Material
Infineon Technologies
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