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FF200R12KE4P Datasheet - Infineon Technologies

FF200R12KE4P image

Part Name
FF200R12KE4P

Other PDF
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page
9 Pages

File Size
570.7 kB

MFG CO.
Infineon
Infineon Technologies Infineon

Electrical Features
• Low switching losses
• Unbeatable robustness
• VCEsat with positive temperature coefficient

Mechanical Features
• Package with CTI>400
• High creepage and clearance distances
• High power density
• Isolated base plate
• Standard housing
• Pre-applied Thermal Interface Material

Typical Applications
• High power converters
• Motor drives
• UPS systems
• Wind turbines


Part Name
Description
PDF
MFG CO.
62mm C-Series module with Trench/Fieldstop IGBT4 and Emitter Controlled HE diode and pre-applied Thermal Interface Material
Infineon Technologies
62mm C-Series module with Trench/Fieldstop IGBT4 and Emitter Controlled HE diode and pre-applied Thermal Interface Material
Infineon Technologies
62mm C-Series module with fast Trench/Fieldstop IGBT4 and Emitter Controlled HE diode and pre-applied Thermal Interface Material
Infineon Technologies
62mm C-Series module with Trench/Fieldstop IGBT4 and Emitter Controlled diode and pre-applied Thermal Interface Material
Infineon Technologies
62mm C-Series module with fast Trench/Fieldstop IGBT4 and Emitter Controlled HE diode and pre-applied Thermal Interface Material
Infineon Technologies
62mm C-Series module with fast Trench/Fieldstop IGBT4 and Emitter Controlled HE diode and pre-applied Thermal Interface Material ( Rev : 2016 )
Infineon Technologies
62mm C-Series module with Trench/Fieldstop IGBT4 and Emitter Controlled diode and pre-applied Thermal Interface Material
Infineon Technologies
62mm C-Series module with Trench/Fieldstop IGBT3 and Emitter Controlled HE diode and pre-applied Thermal Interface Material
Infineon Technologies
62mm C-Series module with Trench/Fieldstop IGBT3 and Emitter Controlled HE diode and pre-applied Thermal Interface Material
Infineon Technologies
62mm C-Series module with Trench/Fieldstop IGBT3 and Emitter Controlled HE diode and pre-applied Thermal Interface Material
Infineon Technologies

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