BSB008NE2LXXUMA1 Datasheet - Infineon Technologies
Part Name
BSB008NE2LXXUMA1
Description
Other PDF
no available.
PDF
page
15 Pages
File Size
1.2 MB
MFG CO.
Infineon Technologies
Features
• Optimized for e-fuse and OR-ing application
• Ultra low RDS(on) in CanPAK-MX footprint
• Low profile (<0.7 mm)
• 100% avalanche tested
• 100% Rg Tested
• Double-sided cooling
• Compatible with DirectFET® package MX footprint and outline1)
• Qualified according to JEDEC2) for target applications
Part Name
Description
PDF
MFG CO.
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