NTMFS4835N
MOSFET – Power, Single,
N-Channel, SO-8FL
30 V, 104 A
Features
• Low RDS(on) to Minimize Conduction Losses
• Low Capacitance to Minimize Driver Losses
• Optimized Gate Charge to Minimize Switching Losses
• These are Pb−Free Devices
Applications
• Refer to Application Note AND8195/D
• CPU Power Delivery
• DC−DC Converters
• Low Side Switching
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current RqJA
(Note 1)
TA = 25°C
TA = 85°C
Power Dissipation
RqJA (Note 1)
TA = 25°C
Continuous Drain
Current RqJA
(Note 2)
Power Dissipation
RqJA (Note 2)
Steady
State
TA = 25°C
TA = 85°C
TA = 25°C
Continuous Drain
Current RqJC
(Note 1)
TC = 25°C
TC = 85°C
Power Dissipation
RqJC (Note 1)
TC = 25°C
Pulsed Drain
Current
TA = 25°C,
tp = 10 ms
Operating Junction and Storage
Temperature
Source Current (Body Diode)
Drain to Source DV/DT
Single Pulse Drain−to−Source Avalanche
Energy TJ = 25°C, VDD = 50 V, VGS = 10 V,
IL = 28 Apk, L = 1.0 mH, RG = 25 W
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
VDSS
VGS
ID
PD
ID
PD
ID
PD
IDM
TJ,
TSTG
IS
dV/dt
EAS
30
V
±20
V
20
A
14
2.27
W
12
A
9.0
0.89
W
104
A
75
62.5
W
208
A
−55 to
+150
52
6
392
°C
A
V/ns
mJ
TL
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surface−mounted on FR4 board using 1 sq−in pad, 1 oz Cu.
2. Surface−mounted on FR4 board using the minimum recommended pad size.
www.onsemi.com
V(BR)DSS
30 V
RDS(ON) MAX
3.5 mW @ 10 V
5.0 mW @ 4.5 V
D (5,6)
ID MAX
104 A
G (4)
S (1,2,3)
N−CHANNEL MOSFET
MARKING
DIAGRAM
1
SO−8 FLAT LEAD
CASE 488AA
STYLE 1
D
S
D
S 4835N
S AYWZZ
G
D
D
A
= Assembly Location
Y
= Year
W
= Work Week
ZZ
= Lot Traceability
ORDERING INFORMATION
Device
NTMFS4835NT1G
Package
SO−8FL
(Pb−Free)
Shipping†
1500 /
Tape & Reel
NTMFS4835NT3G SO−8FL
(Pb−Free)
5000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2012
1
May, 2019 − Rev. 9
Publication Order Number:
NTMFS4835N/D