CY7C1018DV33 View Datasheet(PDF) - Cypress Semiconductor
Part Name
Description
View to exact match
CY7C1018DV33 Datasheet PDF : 21 Pages
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CY7C1018DV33
CY7C1019DV33
Capacitance
Parameter [3]
Description
CIN
COUT
Input Capacitance
Output Capacitance
Thermal Resistance
Parameter [3]
Description
JA
Thermal Resistance
(Junction to Ambient)
JC
Thermal Resistance
(Junction to Case)
Test Conditions
TA = 25 °C, f = 1 MHz, VCC = 3.3 V
Max
Unit
8
pF
8
pF
Test Conditions
Still Air, soldered on a 3 × 4.5
inch, four-layer printed circuit
board
32-pin SOJ
56.29
38.14
32-pin TSOP II 48-ball VFBGA Unit
62.22
36
C/W
21.43
9
C/W
AC Test Loads and Waveforms
Figure 3. AC Test Loads and Waveforms [4]
OUTPUT
Z = 50
* CAPACITIVE LOAD CONSISTS
OF ALL COMPONENTS OF THE
TEST ENVIRONMENT
50
1.5V
(a)
30 pF*
3.0 V
GND
ALL INPUT PULSES
90%
90%
10%
10%
Rise Time: 1 V/ns
(b)
Fall Time: 1 V/ns
High-Z characteristics: R1 317
3.3 V
OUTPUT
5 pF
R2
351
(c)
Notes
3. Tested initially and after any design or process changes that may affect these parameters.
4. AC characteristics (except High Z) are tested using the load conditions shown in Figure 3 (a). High Z characteristics are tested for all speeds using the test load shown
in Figure 3 (c).
Document Number: 38-05481 Rev. *J
Page 5 of 20
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