MPC106 View Datasheet(PDF) - Motorola => Freescale

Part Name

Description

View to exact match

MPC106

PCI Bridge/Memory Controller

Motorola => Freescale 

Electrical and Thermal Characteristics

Characteristic

Supply voltage

PLL supply voltage

Input voltage

Die junction temperature

Table 2. Recommended Operating Conditions

Symbol

Value

Vdd

AVdd

Vin

Tj

3.3 ± 165 mv

3.3 ± 165 mv

0 to 5.5

0 to 105

Unit

Notes

V

—

V

—

V

—

°C The extended temperature parts have die junction

temperature of -40 to 105°C

Table 3 provides the package thermal characteristics for the 106.

Table 3. Package Thermal Characteristics

Characteristic

Symbol

Value

Rating

CBGA package thermal resistance, junction-to-top of die

θJC

0.133

Note: Refer to Section 1.8, “System Design Information,” for more details about thermal management.

°C/W

Table 4 provides the DC electrical characteristics for the 106, assuming Vdd = AVdd = 3.3 ± 5% V DC,

GND = 0 V DC, and 0 ≤ Tj ≤ 105 °C.

Table 4. DC Electrical Specifications

Characteristic

Symbol

Min

Max

Unit

Input high voltage (all inputs except SYSCLK)

VIH

2

5.5

V

Input low voltage (all inputs except SYSCLK)

VIL

GND

0.8

V

SYSCLK input high voltage

CVIH

2.4

5.5

V

SYSCLK input low voltage

Input leakage current, Vin =3.3 V1

Hi-Z (off-state) leakage current, Vin = 3.3 V1

Output high voltage, IOH = -7 mA2

Output low voltage, IOL = 7 mA2

PCI 3.3 V signaling output high voltage, IOH = -0.5 mA2

PCI 3.3 V signaling output low voltage, IOL = 1.5 mA2

Capacitance, Vin = 0 V, f = 1 MHz3

CVIL

GND

0.4

V

Iin

—

15.0

µA

ITSI

—

15.0

µA

VOH

2.4

—

V

VOL

—

0.5

V

VOH

2.7

—

V

VOL

—

0.3

V

Cin

—

7.0

pF

Notes:

1 Excludes test signals (LSSD_MODE and JTAG signals).

2 This value represents worst case 40-ohm drivers (default value for Processor/L2 control signals CI, WT, GBL, TBST,

TSIZ[0–2], TT[0–4], TWE, and TV) only. Other signals have lower default driver impedance and will support larger

IOH and IOL. All drivers may optionally be programmed to different driver strengths.

3 Capacitance is periodically sampled rather than 100% tested.

Table 5 lists the power consumption of the 106.

6

MPC106 PCI Bridge/Memory Controller Hardware Specifications

Share Link: