MAPCGM0003-DIE View Datasheet(PDF) - Tyco Electronics
Part Name
Description
View to exact match
MAPCGM0003-DIE Datasheet PDF : 7 Pages
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2.3-4.1 GHz Phase Shifter
RFIN
IN
MAPCGM0003-DIE
RO-P-DS-3045 A
Preliminary Information
100 pF
0.1 μF
P5.6 P11 P22 VEE P45 P90 P180
VEE
CONTROL
INPUTS
6
RFOUT
OUT
Figure 6. Recommended bonding diagram for pedestal mount.
Support circuitry typical of MMIC characterization.
Assembly Instructions:
Die attach: Use AuSn (80/20) 1-2 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques.
For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge
bonds of shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to VEE before applying positive bias to Control Pads.
7
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
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