MAPCGM0003-DIE View Datasheet(PDF) - Tyco Electronics
Part Name
Description
View to exact match
MAPCGM0003-DIE Datasheet PDF : 7 Pages
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2.3-4.1 GHz Phase Shifter
MAPCGM0003-DIE
RO-P-DS-3045 A
Preliminary Information
Mechanical Information
Chip Size: 3.814 x 1.355 x 0.075 mm (150 x 55 x 3 mils)
1.355mm.
0.985mm.
IN
P5.6 P11 P22 VEE P45 P90 P180
0
0
Figure 5. Die Layout
1.494mm.
OUT
0.945mm.
Bond Pad Dimensions
Pad
RF In and Out
DC Supply Voltage VEE
DC Control Voltage VC
Size (μm)
100 x 200
125 x 125
125 x 125
Size (mils)
4x8
5x5
5x5
6
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product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
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Visit www.macom.com for additional data sheets and product information.
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