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UG4KB10 数据手册 ( 数据表 ) - Burland Technology Solutions

UG4KB05 image

零件编号
UG4KB10

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page
5 Pages

File Size
380.4 kB

生产厂家
BURLAND
Burland Technology Solutions 

Features
• Glass passivated die construction
• Low forward voltage drop
• High current capability
• High surge current capability
• Designed for surface mount application
• Plastic material-UL flammability 94V-0
• This is a Pb − Free Device
• All SMC parts are traceable to the wafer lot
• Additional testing can be offered upon request

Mechanical Data
• Case: D3K, Molded plastic
• Terminals: Plated leads solderable per MIL-STD-202,
   Method 208
• Polarity: as marked on case
• Mounting Position: Any
• Lead Free: For RoHS / Lead Free Version


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