TSS54U(V_A07) 数据手册 ( 数据表 ) - TSC Corporation
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TSC Corporation
Features
✧ Designed for mounting on small surface
✧ Extremely thin/leadless package
✧ Low capacitance
✧ Low forward voltage drop
✧ High temperature soldering:
260°C/10 seconds at terminals
✧ Chip version in 0603
Mechanical Data
✧ Case: 0603 Standard package, molded plastic
✧ Terminals: Gold plated, solderable per
MIL-STD-750, method 2026.
✧ Polarity: Indicated by cathode band
✧ Mounting position: Any
✧ Package code: RZ
✧ Weight: 0.003 gram (approximately)
0.2Amp Surface Mount Schottky Barrier Diode
( Rev : V_A07 )
TSC Corporation
0.2Amp Surface Mount Schottky Barrier Diode
( Rev : A07 )
TSC Corporation
0.2Amp Surface Mount Schottky Barrier Diode
( Rev : A07 )
TSC Corporation
0.2Amp Surface Mount Schottky Barrier Diode ( Rev : V_A07 )
TSC Corporation
0.2Amp Surface Mount Schottky Barrier Diode ( Rev : V_A07 )
TSC Corporation
0.2Amp Surface Mount Schottky Barrier Diode ( Rev : V_A07 )
TSC Corporation
0.2Amp Surface Mount Schottky Barrier Diode
TSC Corporation
0.2Amp Surface Mount Schottky Barrier Diode ( Rev : V_A07 )
TSC Corporation
0.2Amp Surface Mount Schottky Barrier Diode ( Rev : V_A07 )
TSC Corporation
Surface mount schottky barrier diode
( Rev : V2 )
Galaxy Semi-Conductor