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TSS54L(V_A07) 数据手册 ( 数据表 ) - TSC Corporation

TSS54L image

零件编号
TSS54L

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page
2 Pages

File Size
56.7 kB

生产厂家
TSC
TSC Corporation 

Features
✧ Designed for mounting on small surface
✧ Extremely thin/leadless package
✧ Low capacitance
✧ Low forward voltage drop
✧ High temperature soldering:
   260°C/10 seconds at terminals
✧ Chip version in 1005

Mechanical Data
✧ Case: 1005 Standard package, molded plastic
✧ Terminals: Gold plated, solderable per
                     MIL-STD-750, method 2026.
✧ Polarity: Indicated by cathode band
✧ Mounting position: Any
✧ Package code: RW
✧ Weight: 0.006 gram (approximately)


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