FEATURES
   Very low profile - typical height of 1.1 mm
   Ideal for automated placement
   Low forward voltage drop, low power losses
   High efficiency
   Low thermal resistance
   Meets MSL level 1, per J-STD-020
   Solder dip 260 °C max. 10 s, per JESD 22-A111
   Compliant to RoHS directive 2002/95/EC and in accordance to
   WEEE 2002/96/EC