Features
• Batch process design, excellent power dissipation offers
   better reverse leakage current and thermal resistance.
• Low profile surface mounted application in order to
   optimize board space.
• Tiny plastic SMD package.
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• High surge capability.
• Guardring for overvoltage protection.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
• Moisture Sensitivity Level 1

Mechanical data
• Epoxy : UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123-L
• Terminals :Plated terminals, solderable per MIL-STD-750,
                    Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.018 gram