S1AL(V_B07) 数据手册 ( 数据表 ) - TSC Corporation
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TSC Corporation
Features
✧ For surface mounted application
✧ Glass passivated junction chip.
✧ Low-Profile Package
✧ Ideal for automated placement
✧ Low power loss, high efficiency
✧ High temperature soldering:
260°C / 10 seconds at terminals
Mechanical Data
✧ Case: Sub SMA plastic case
✧ Terminal : Pure tin plated, lead free.
✧ Polarity: Color band denotes cathode
✧ Packaging: 12mm tape per EIA STD RS-481
✧ Weight: approx. 15mg
✧ Marking code refer to Note 3.
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