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Shanghai Yint Electronic Co., Ltd.
Features
● For surface mounted applications
● Low profile package
● Glass Passivated Chip Junction
● Easy to pick and place
● Lead free in comply with EU RoHS 2011/65/EU directives
Mechanical Data
● Case: SMA
● Terminals: Solderable per MIL-STD-750, Method 2026
● Approx. Weight: 0.055g / 0.002oz
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