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RB520G-30(V_B12) 数据手册 ( 数据表 ) - TSC Corporation

RB520G-30 image

零件编号
RB520G-30

Other PDF
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page
3 Pages

File Size
228.5 kB

生产厂家
TSC
TSC Corporation 

Features
◇ Ultra smail mold type,high reliability,low IR low VF
◇ Surface device type mounting
◇ Moisture sensitivity level 1
◇ Matte Tin(Sn) lead finish with Nickel(Ni) underplate
◇ Pb free version and RoHS compliant
◇ Green compound (Halogen free) with suffix "G" on
   packing code and prefix "G" on date code

Mechanical Data
◇ Case : Flat lead SOD-723F small outline plastic package
◇ Terminal: Matte tin plated, lead free., solderable
   per MIL-STD-202, Method 208 guaranteed
◇ High temperature soldering guaranteed: 260°C/10s
◇ Polarity : Indicated by cathode band
◇ Weight:0.847±0.5mg
◇ Marking Code : F


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