Features
• High current capability, low forward voltage drop
• High surge current capability
• Low power loss, high efficiency
• High temperature soldering guaranteed, 250°C/10 seconds
• Low profile surface mounted package in order to minimize board space
• Pb-free lead plating and halogen-free package

Mechanical data
• Case : Molded plastic, JEDEC SOD-123.
• Epoxy : UL94-V0 rated flame retardant
• Terminals : Plated terminals, solderable per MIL-STD-202 method 208
• Polarity : Indicated by cathode band
• Mounting position : Any
• Weight : approx. 0.04 gram