The MOCD217 device consists of two gallium arsenide infrared emitting diodes optically coupled to two monolithic silicon phototransistor detectors, in a surface mountable, small outline, plastic package. It is ideally suited for high density applications and eliminates the need for through–the–board mounting.

• Dual Channel Coupler
• Convenient Plastic SOIC–8 Surface Mountable Package Style
• Low Input Current (Specified @ 1 mA)
• Minimum V(BR)CEO of 30 Volts Guaranteed
• Standard SOIC–8 Footprint, with 0.050″ Lead Spacing
• Shipped in Tape and Reel, which conforms to EIA Standard RS481A
• Compatible with Dual Wave, Vapor Phase and IR Reflow Soldering
• High Input–Output Isolation of 3000 Vac (rms) Guaranteed
• Meets U.L. Regulatory Requirements, File #E90700, Volume 2