Features
• Low VF and low IR type
• High junction temperature capability
• High current capability
• High surge capability
• Good tradeoff between leakage current and forward voltage drop
• Low power loss, high efficiency
• RoHS compliant package
• Pb-free lead plating

Mechanical Data
• Case: TO-252 molded plastic
• Mounting Position: Any
• Weight: 0.34 grams approximately
• Terminals: Pure tin plated, lead-free, solderable per MIL-STD-750 method 2026
• Epoxy: UL 94V-0 rate flame retardant
• Lead temperature for soldering purpose : 260℃ max. for 10 seconds