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LSP1012(2000) 数据手册 ( 数据表 ) - Microsemi Corporation

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零件编号
LSP1012

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3 Pages

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277.4 kB

生产厂家
Microsemi
Microsemi Corporation 

DESCRIPTION
Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistency of performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high performance wireless applications including VCOs, limiters, pin switches and pin attenuators. Select PIN diodes for switching, attenuation or limiting through 6 GHz. They are available in multiple chip configuration as well as outlines which directly replace SOT- 23 and SOD-323 devices. Other devices and values are always available - contact our applications engineering department for more details.


KEY FEATURES
▪ Frequencies from VHF to 6 GHz
▪ Lower Parasitics
▪ Mil Grade Ceramic/Epoxy Amalgam Construction
▪ Dense SiO2 Junction Passivation
▪ Superior Consistency/Repeatability
▪ Footprints Available for SOT-23/SOD-323/SOD-123
▪ Priced for Commercial Products
▪ Tape & Reel for Volume Pick & Place


APPLICATIONS/BENEFIT
▪ High performance wireless surface mounting including:
▪ GSM
▪ TAGS
▪ WANS
▪ PCS
▪ AMPS
▪ DECT
▪ CELLULAR

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