LOR970 数据手册 ( 数据表 ) - Siemens AG
生产厂家

Siemens AG
Features
● 0805 package
● Industry standard footprint
● low profile
● suitable for IR reflow soldering process
● for use as optical indicator and backlighting
● available taped on reel (8 mm tape)
CHIPLED
Infineon Technologies
CHIPLED
Infineon Technologies
CHIPLED
Infineon Technologies
Multi CHIPLED ( Rev : 2017 )
OSRAM GmbH
CHIPLED 0603 ( Rev : 2013 )
OSRAM GmbH