Description
   The SOP-8 has been modied through a customizec leadframe for enhanced thermal characteristics and multiple die capability making it ideal in a variety of power applications.
   With these improvements. multiple devices can be used in an application with dramatically reduced board space.
   The package is designed for vapor phase. intra red. or wave soldering techniques. Power dissipation of greater than 0.8W is possible in a typical PCB mount application.

FEATUREs
● VDS (V) = 30V
● ID = 5.3 A
● RDS(ON) < 50mΩ (VGS = -10V)
● RDS(ON) < 80mΩ (VGS = -4.5V)
● Generation VTechnology
● Ultra Low On-Resistance
● Surface Mount
● Dynamic dv/dt Rating
● Fast Switching
● Lead-Free