FEATURES
• Power pack
• Glass passivated pellet chip junction
• Ultrafast recovery time
• Low switching losses, high efficiency
• Low leakage current
• High forward surge capability
• Solder dip 275 °C max., 10 s per JESD 22-B106
• Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

TYPICAL APPLICATIONS
    For use in high frequency rectifier of switching mode power supplies, inverters, freewheeling diodes, DC/DC converters, and other power switching application.