FS500R17OE4DP 数据手册 ( 数据表 ) - Infineon Technologies
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Infineon Technologies
Electrical Features
• High short-circuit capability
• High surge current capability
• Unbeatable robustness
• Tvjop=150°C
• Trench IGBT 4
Mechanical Features
• High mechanical robustness
• Integrated NTC temperature sensor
• Isolated base plate
• PressFIT contact technology
• RoHS compliant
• Pre-applied Thermal Interface Material
Typical Applications
• Auxiliary inverters
• High power converters
• Motor drives
• Wind turbines
EconoPACK™ + module with Trench/Fieldstop IGBT4 and Emitter Controlled 3 diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
EasyPIM™ module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
EasyPIM™ module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
EconoDUAL™3 module with Trench/Fieldstop IGBT4 and Emitter Controlled HE diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
EconoDUAL™3 module with Trench/Fieldstop IGBT4 and Emitter Controlled HE diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
EconoPACK™ + module with Trench/Fieldstop IGBT4 and Emitter Controlled HE diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
EconoPACK™2 module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
EconoPACK™4 module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
EconoPACK™2 module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
EconoDUAL™3 module with Trench/Fieldstop IGBT4 and Emitter Controlled diode and NTC / pre-applied Thermal Interface Material
Infineon Technologies