FP35R12W2T4P_B11 数据手册 ( 数据表 ) - Infineon Technologies
生产厂家

Infineon Technologies
Electrical Features
• Low Switching Losses
• Low VCEsat
• Trench IGBT 4
• VCEsat with positive Temperature Coefficient
Mechanical Features
• Al2O3 Substrate with Low Thermal Resistance
• Compact design
• PressFIT contact technology
• Rugged mounting due to integrated mounting
clamps
• Pre-applied Thermal Interface Material
Typical Applications
• Auxiliary Inverters
• Air Conditioning
• Motor Drives
EasyPIM™ module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
EconoPACK™4 module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
EconoPACK™2 module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
EconoPACK™ + module with Trench/Fieldstop IGBT4 and Emitter Controlled 3 diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
EconoPACK™ + module with Trench/Fieldstop IGBT4 and Emitter Controlled 3 diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
EconoPACK™2 module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
EconoPACK™4 module with fast Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
EconoPACK™ + module with Trench/Fieldstop IGBT4 and Emitter Controlled HE diode and PressFIT / pre-applied Thermal Interface Material
Infineon Technologies
IHM-B module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and pre-applied Thermal Interface Material
Infineon Technologies
IHM-B module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and pre-applied Thermal Interface Material
Infineon Technologies