FF400R12KT3P_E 数据手册 ( 数据表 ) - Infineon Technologies
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Infineon Technologies
Electrical Features
• Low switching losses
• Unbeatable robustness
• VCEsat with positive temperature coefficient
Mechanical Features
• Package with CTI>400
• High creepage and clearance distances
• High power density
• Isolated base plate
• Standard housing
• Pre-applied Thermal Interface Material
Typical Applications
• High power converters
• Motor drives
• UPS systems
• Wind turbines
62mm C-Series module with Trench/Fieldstop IGBT3 and Emitter Controlled HE diode and pre-applied Thermal Interface Material
Infineon Technologies
62mm C-Series module with Trench/Fieldstop IGBT3 and Emitter Controlled HE diode and pre-applied Thermal Interface Material
Infineon Technologies
62mm C-Series module with Trench/Fieldstop IGBT4 and Emitter Controlled HE diode and pre-applied Thermal Interface Material
Infineon Technologies
62mm C-Series module with Trench/Fieldstop IGBT4 and Emitter Controlled HE diode and pre-applied Thermal Interface Material
Infineon Technologies
62mm C-Series module with Trench/Fieldstop IGBT4 and Emitter Controlled HE diode and pre-applied Thermal Interface Material
Infineon Technologies
62mm C-Series module with fast Trench/Fieldstop IGBT4 and Emitter Controlled HE diode and pre-applied Thermal Interface Material
Infineon Technologies
62mm C-Series module with Trench/Fieldstop IGBT4 and Emitter Controlled diode and pre-applied Thermal Interface Material
Infineon Technologies
62mm C-Series module with fast Trench/Fieldstop IGBT4 and Emitter Controlled HE diode and pre-applied Thermal Interface Material
Infineon Technologies
62mm C-Series module with fast Trench/Fieldstop IGBT4 and Emitter Controlled HE diode and pre-applied Thermal Interface Material ( Rev : 2016 )
Infineon Technologies
62mm C-Series module with Trench/Fieldstop IGBT4 and Emitter Controlled diode and pre-applied Thermal Interface Material
Infineon Technologies