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DSI30-12AC 数据手册 ( 数据表 ) - IXYS CORPORATION

DSI30 image

零件编号
DSI30-12AC

Other PDF
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page
1 Pages

File Size
78.4 kB

生产厂家
IXYS
IXYS CORPORATION 

Features
• Silicon chip on Direct-Copper-Bond substrate
   - High power dissipation
   - Isolated mounting surface
   - 2500V electrical isolation
• Low cathode to tab capacitance(15pF typical)
• International standard package
• Epoxy meets UL 94V-0


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