零件编号
CP622
产品描述 (功能)
Other PDF
no available.
PDF
page
2 Pages
File Size
217.8 kB
生产厂家
Central Semiconductor
CP622 数据手册 ( 数据表 ) - Central Semiconductor
Central Semiconductor
PROCESS DETAILS
Process PLANAR PASSIVATED
Die Size 27.5 x 27.5 MILS
Die Thickness 11 MILS
Anode Bonding Pad Area 7.1 x 5.1 MILS
Cathode Bonding Pad Area 7.1 x 5.1 MILS
Top Side Metalization Al - 30,000Å
Back Side Metalization Au - 13,000Å
零件编号
产品描述 (功能)
视图
生产厂家
Share Link: 