FEATURES
• Low profile package
• Ideal for automated placement
• Glass passivated junction
• Low reverse current
• Low forward voltage
• Soft recovery characteristic
• Ultra fast reverse recovery time
• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
• Solder dip 260 °C, 40 s
• Component in accordance to RoHS 2002/95/EC
   and WEEE 2002/96/EC

TYPICAL APPLICATIONS
   For use in high frequency rectification and
   freewheeling application in switching mode converters
   and inverters for consumer, computer, automotive and
   telecommunication.