BYD72B 数据手册 ( 数据表 ) - Philips Electronics
生产厂家
Philips Electronics
DESCRIPTION
Cavity free cylindrical glass SOD120 package through Implotec(1) technology. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy absorption capability
• Available in ammo-pack.
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