BA82902YXXX-C 查看數據表（PDF） - ROHM Semiconductor

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BA82902YXXX-C

Automotive Excellent EMI Characteristics Ground Sense Operational Amplifiers

ROHM Semiconductor 

BA82904Yxxx-C BA82902Yxxx-C

Thermal Resistance(Note 1)

Parameter

Symbol

Thermal Resistance (Typ)

1s(Note 3)

2s2p(Note 4)

Unit

MSOP8

Junction to Ambient

θJA

Junction to Top Characterization Parameter(Note 2)

ΨJT

284.1

21

135.4

11

°C/W

°C/W

SOP8

Junction to Ambient

θJA

Junction to Top Characterization Parameter(Note 2)

ΨJT

197.4

21

109.8

19

°C/W

°C/W

SOP14

Junction to Ambient

θJA

Junction to Top Characterization Parameter(Note 2)

ΨJT

166.5

26

108.1

22

°C/W

°C/W

SSOP-B14

Junction to Ambient

θJA

Junction to Top Characterization Parameter(Note 2)

ΨJT

159.6

13

92.8

°C/W

9

°C/W

SOP-J14

Junction to Ambient

θJA

Junction to Top Characterization Parameter(Note 2)

ΨJT

118.5

10

67.2

°C/W

10

°C/W

TSSOP-B14J

Junction to Ambient

θJA

185.4

98.4

°C/W

Junction to Top Characterization Parameter(Note 2)

ΨJT

16

14

°C/W

(Note 1) Based on JESD51-2A(Still-Air).

(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 3) Using a PCB board based on JESD51-3.

(Note 4) Using a PCB board based on JESD51-7.

Layer Number of

Measurement Board

Material

Board Size

Single

FR-4

114.3mm x 76.2mm x 1.57mmt

Top

Copper Pattern

Footprints and Traces

Layer Number of

Measurement Board

4 Layers

Thickness

70μm

Material

FR-4

Board Size

114.3mm x 76.2mm x 1.6mmt

Top

Copper Pattern

Footprints and Traces

Thickness

70μm

2 Internal Layers

Copper Pattern

Thickness

74.2mm x 74.2mm

35μm

Bottom

Copper Pattern

74.2mm x 74.2mm

Thickness

70μm

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20.Feb.2018 Rev.007

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