WE128K32N-300H1Q 查看數據表（PDF） - White Electronic Designs => Micro Semi
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WE128K32N-300H1Q Datasheet PDF : 15 Pages
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WE128K32-XXX
FIG. 12 ALTERNATE PIN CONFIGURATION FOR WE128K32NP-XH1X
TOP VIEW
1
12
23
34
45
56
I/O8
WE2
I/O15
I/O24
VCC
I/O31
I/O9
CS2
I/O14
I/O25
CS4
I/O30
I/O10
GND
I/O13
I/O26
WE4
I/O29
A14
I/O11
I/O12
A7
I/O27
I/O28
A16
A10
OE
A12
A4
A1
A11
A9
NC
A0
A15
WE1
NC
VCC
I/O7
I/O0
CS1
I/O6
NC
A13
A8
I/O16
A5
A6
WE3
CS3
A2
A3
I/O23
I/O22
OE
A0-16
BLOCK DIAGRAM
W E1C S 1
W E2 C S2
W E3 C S 3
128K x 8
128K x 8
128K x 8
I/O1
NC
I/O5
I/O2
I/O3
I/O4
11
22
33
I/O17 GND
I/O21
I/O18
I/O19
I/O20
44
55
66
8
I/O0-7
8
I/O8-15
8
I/O16-23
PIN DESCRIPTION
I/O0-31 Data Inputs/Outputs
A0-16
Address Inputs
WE1-4
Write Enables
CS1-4
Chip Selects
OE
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
W E 4C S4
128K x 8
8
I/O24-31
ORDERING INFORMATION
W E 128K32 X - XXX X X X
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
Q = Compliant
M = Military Screened
I = Industrial
C = Commercial
-55°C to +125°C
-40°C to +85°C
0°C to +70°C
PACKAGE TYPE:
H1 = 1.075" sq. Ceramic Hex In-line Package, HIP (Package 400*)
G2T = 22.4mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 509)
G1U = 22.4mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 519)
G4 = 40mm Ceramic Quad Flat Pack, CQFP (Package 501)
ACCESS TIME (ns)
IMPROVEMENT MARK
N = No Connect at pins 8, 21, 28, and 39 in HIP for upgrade
P = Alternate Pin Configuration for HIP package
ORGANIZATION 128K x 32
User Configurable as 256K x 16 or 512K x 8
EEPROM
WHITE ELECTRONIC DESIGNS CORP.
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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