Table 3. ESD Protection Characteristics
Test Methodology
Class
Human Body Model (per JESD22--A114)
2 (Minimum)
Machine Model (per EIA/JESD22--A115)
B (Minimum)
Charge Device Model (per JESD22--C101)
IV (Minimum)
Table 4. Electrical Characteristics (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Off Characteristics (1)
Gate--Source Leakage Current
(VGS = 5 Vdc, VDS = 0 Vdc)
Drain--Source Breakdown Voltage
(VGS = 0 Vdc, ID = 100 mA)
Zero Gate Voltage Drain Leakage Current
(VDS = 50 Vdc, VGS = 0 Vdc)
Zero Gate Voltage Drain Leakage Current
(VDS = 100 Vdc, VGS = 0 Vdc)
IGSS
—
—
V(BR)DSS
125
—
IDSS
—
—
IDSS
—
—
1
μAdc
—
Vdc
10
μAdc
20
μAdc
On Characteristics
Gate Threshold Voltage (1)
(VDS = 10 Vdc, ID = 1776 μAdc)
Gate Quiescent Voltage
(VDD = 50 Vdc, ID = 100 mAdc, Measured in Functional Test)
Drain--Source On--Voltage (1)
(VGS = 10 Vdc, ID = 2 Adc)
Dynamic Characteristics (1)
Reverse Transfer Capacitance
(VDS = 50 Vdc ± 30 mV(rms)ac @ 1 MHz, VGS = 0 Vdc)
Output Capacitance
(VDS = 50 Vdc ± 30 mV(rms)ac @ 1 MHz, VGS = 0 Vdc)
Input Capacitance
(VDS = 50 Vdc, VGS = 0 Vdc ± 30 mV(rms)ac @ 1 MHz)
VGS(th)
1.7
2.2
2.7
Vdc
VGS(Q)
1.4
2.2
2.9
Vdc
VDS(on)
—
0.15
—
Vdc
Crss
—
2.8
—
pF
Coss
—
185
—
pF
Ciss
—
562
—
pF
Functional Tests (In Freescale Test Fixture, 50 ohm system) VDD = 50 Vdc, IDQ = 100 mA, Pout = 1250 W Peak (250 W Avg.), f = 230 MHz,
Pulsed, 100 μsec Pulse Width, 20% Duty Cycle
Power Gain
Drain Efficiency
Gps
23.0
24.0
26.0
dB
ηD
72.5
74.0
—
%
Input Return Loss
IRL
—
--14
--10
dB
Pulsed RF Performance (In Freescale Application Test Fixture, 50 ohm system) VDD = 50 Vdc, IDQ = 100 mA, Pout = 1250 W Peak
(250 W Avg.), f = 230 MHz, Pulsed, 100 μsec Pulse Width, 20% Duty Cycle
Load Mismatch
(VSWR 65:1 at all Phase Angles)
Ψ
No Degradation in Output Power
1. Each side of device measured separately.
MRFE6VP61K25HR6 MRFE6VP61K25HSR6
2
RF Device Data
Freescale Semiconductor