BTA208X-600F 查看數據表（PDF） - Unspecified

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BTA208X-600F

3Q Hi-Com Triac

Unspecified 

WeEn Semiconductors

BTA208X-600F

3Q Hi-Com Triac

8. Thermal characteristics

Table 5. Thermal characteristics

Symbol

Parameter

Rth(j-h)

thermal resistance

from junction to

heatsink

Rth(j-a)

thermal resistance

from junction to

ambient free air

Conditions

full cycle or half cycle; with heatsink

compound; Fig. 6

full cycle or half cycle; without heatsink

compound; Fig. 6

in free air

10

Zth(j-h)

(K/W)

1

(1)

(2)

(3)

(4)

Min Typ Max Unit

-

-

4.5 K/W

-

-

6.5 K/W

-

55

-

K/W

003aaf915

10- 1

P

10- 2

10- 3

10- 5

10- 4

10- 3

10- 2

10- 1

(1) Unidirectional (half cycle) without heatsink compound

(2) Unidirectional (half cycle) with heatsink compound

(3) Bidirectional (full cycle) without heatsink compound

(4) Bidirectional (full cycle) with heatsink compound

tp

t

1

10

tp (s)

Fig. 6. Transient thermal impedance from junction to heatsink as a function of pulse duration

9. Isolation characteristics

Table 6. Isolation characteristics

Symbol

Parameter

Visol(RMS)

RMS isolation voltage

Cisol

isolation capacitance

Conditions

from all terminals to external heatsink;

sinusoidal waveform; clean and dust

free; 50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %;

Th = 25 °C

from main terminal 2 to external

heatsink; f = 1 MHz; Th = 25 °C

Min Typ Max Unit

-

-

2500 V

-

10

-

pF

BTA208X-600F

Product data sheet

All information provided in this document is subject to legal disclaimers.

19 September 2018

© WeEn Semiconductors Co., Ltd. 2018. All rights reserved

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