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EL2250 查看數據表(PDF) - Renesas Electronics

零件编号
产品描述 (功能)
生产厂家
EL2250
Renesas
Renesas Electronics 
EL2250 Datasheet PDF : 15 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
EL2250, EL2450
Typical Performance Curves (Continued)
Supply Current vs Supply Voltage
(per amplifier)
Supply Current vs Die
Temperature (per amplifier)
Input Resistance vs Die
Temperature
Offset Voltage vs Die Temperature
(4 Samples)
Input Bias Current vs Input Voltage
Input Offset Current and Input Bias
Current vs Die Temperature
Positive Output Voltage Swing vs
Die Temperature, RL = 150to
GND
Negative Output Voltage Swing vs
Die Temperature, RL = 150to
GND
Channel to Channel Isolation vs
Frequency
Package Power Dissipation vs Ambient Temp.
SEMI G42-88 Single Layer Test Board
1.8
1.6 1.54W
1.4 1.25W
1.2
JA =P8D1°IPC1/W4
1
0.8
0.6
JA =1P0D0I°PC8/W
0.4
0.2
0
0
25
50
75 85 100 125 150
Ambient Temperature (°C)
FN7061 Rev 3.00
May 19, 2006
Package Power Dissipation vs Ambient Temp.
JEDEC JESD51-3 Low Effective Thermal Conductivity
Test Board
1.2
1.042W
1
0.8
0.6
0.4
781W SO8 JA =S1O6104°CJ/AW=120°C/W
0.2
0
0
25
50
75 85 100 125 150
Ambient Temperature (°C)
Page 9 of 15

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