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BYG23ME3G 查看數據表(PDF) - TSC Corporation

零件编号
产品描述 (功能)
生产厂家
BYG23ME3G
TSC
TSC Corporation 
BYG23ME3G Datasheet PDF : 4 Pages
1 2 3 4
FIG. 5 TYPICAL INSTANTANEOUS
FORWARD CHARACTERISTICS
10
BYG23M
Taiwan Semiconductor
1
0.1
0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3
FORWARD VOLTAGE (V)
PACKAGE OUTLINE DIMENSIONS
DO-214AC (SMA)
DIM.
A
B
C
D
E
F
G
H
Unit (mm)
Min
Max
1.27 1.58
4.06 4.60
2.29 2.83
1.99 2.50
0.90 1.41
4.95 5.33
0.10 0.20
0.15 0.31
Unit (inch)
Min
Max
0.050 0.062
0.160 0.181
0.090 0.111
0.078 0.098
0.035 0.056
0.195 0.210
0.004 0.008
0.006 0.012
SUGGESTED PAD LAYOUT
Symbol
A
B
C
D
E
MARKING DIAGRAM
P/N =
G=
YW =
F=
Specific Device Code
Green Compound
Date Code
Factory Code
Document Number: DS_D1411087
Unit (mm)
1.68
1.52
3.93
2.41
5.45
Unit (inch)
0.066
0.060
0.155
0.095
0.215
Version: B14

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