BSP318S(2008) 查看數據表（PDF） - Infineon Technologies
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BSP318S Datasheet PDF : 9 Pages
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Rev 2.2
BSP318S
Thermal Characteristics
Parameter
Characteristics
Thermal resistance, junction - soldering point
(Pin 4)
SMD version, device on PCB:
@ min. footprint
@ 6 cm2 cooling area 1)
Symbol
Values
Unit
min. typ. max.
RthJS
RthJA
-
17
- K/W
-
100
-
-
-
70
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Values
min. typ. max.
Static Characteristics
Drain- source breakdown voltage
VGS = 0 V, ID = 0.25 mA
Gate threshold voltage, VGS = VDS
ID = 20 µA
Zero gate voltage drain current
VDS = 60 V, VGS = 0 V, Tj = 25 °C
VDS = 60 V, VGS = 0 V, Tj = 150 °C
Gate-source leakage current
VGS = 20 V, VDS = 0 V
Drain-Source on-state resistance
VGS = 4.5 V, ID = 2.6 A
Drain-Source on-state resistance
VGS = 10 V, ID = 2.6 A
V(BR)DSS 60
-
-
VGS(th) 1.2 1.6
2
IDSS
IGSS
-
0.1
1
-
-
100
-
10 100
RDS(on)
-
0.12 0.15
RDS(on)
-
0.07 0.09
Unit
V
µA
nA
Ω
1Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
Page 2
2008-03-21
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