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74AC377 查看數據表(PDF) - Fairchild Semiconductor

零件编号
产品描述 (功能)
生产厂家
74AC377
Fairchild
Fairchild Semiconductor 
74AC377 Datasheet PDF : 13 Pages
First Prev 11 12 13
Physical Dimensions (Continued)
Figure 3. 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©1988 Fairchild Semiconductor Corporation
74AC377, 74ACT377 Rev. 1.6.1
11
www.fairchildsemi.com

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