MT48LC8M16A2FB 查看數據表（PDF） - Micron Technology
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MT48LC8M16A2FB Datasheet PDF : 85 Pages
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128Mb: x4, x8, x16 Automotive SDRAM
Temperature and Thermal Impedance
Temperature and Thermal Impedance
It is imperative that the SDRAM device’s temperature specifications, shown in Temper-
ature Limits below, be maintained to ensure the junction temperature is in the proper
operating range to meet data sheet specifications. An important step in maintaining the
proper junction temperature is using the device’s thermal impedances correctly. The
thermal impedances are listed in Thermal Impedance Simulated Values for the applica-
ble die revision and packages being made available. These thermal impedance values
vary according to the density, package, and particular design used for each device.
Incorrectly using thermal impedances can produce significant errors. Read Micron
technical note TN-00-08, “Thermal Applications” prior to using the thermal impedan-
ces listed in Thermal Impedance Simulated Values. To ensure the compatibility of cur-
rent and future designs, contact Micron Applications Engineering to confirm thermal
impedance values.
The SDRAM device’s safe junction temperature range can be maintained when the TC
specification is not exceeded. In applications where the device’s ambient temperature
is too high, use of forced air and/or heat sinks may be required to satisfy the case tem-
perature specifications.
Table 5: Temperature Limits
Parameter
Symbol
Min
Max
Unit
Notes
Operating case temperature
Commercial
Industrial
TC
0
80
°C
1, 2, 3, 4
–40
90
Automotive
–40
105
Junction temperature
Commercial
Industrial
TJ
0
85
°C
3
–40
95
Ambient temperature
Automotive
Commercial
Industrial
Automotive
–40
110
TA
0
70
°C
3, 5
–40
85
–40
105
Peak reflow temperature
TPEAK
–
260
°C
Notes:
1. MAX operating case temperature, TC, is measured in the center of the package on the
top side of the device, as shown in Figure 10 (page 20), Figure 11 (page 21), and Fig-
ure 12 (page 21).
2. Device functionality is not guaranteed if the device exceeds maximum TC during
operation.
3. All temperature specifications must be satisfied.
4. The case temperature should be measured by gluing a thermocouple to the top-center
of the component. This should be done with a 1mm bead of conductive epoxy, as de-
fined by the JEDEC EIA/JESD51 standards. Take care to ensure that the thermocouple
bead is touching the case.
5. Operating ambient temperature surrounding the package.
PDF: 09005aef84baf515
128mb_x4x8x16_ait-aat_sdram.pdf - Rev. C 1/14 EN
18
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 1999 Micron Technology, Inc. All rights reserved.
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