MAX77178 查看數據表（PDF） - Maxim Integrated

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MAX77178

High-Bandwidth LTE/WCDMA PA Power Management ICs in a 1.75mm x 1.4mm, 0.4mm Pitch WLP

Maxim Integrated 

MAX77178 / MAX77179

High-Bandwidth LTE/WCDMA PA Power Management ICs

in a 1.75mm x 1.4mm, 0.4mm Pitch WLP

ABSOLUTE MAXIMUM RATINGS

IN1, IN2 to PGND..................................................-0.3V to +6.0V

IN3 to AGND.........................................................-0.3V to +6.0V

SEL0, SEL1, EN, FB to AGND (MAX77179).-0.3V to (VIN3 + 0.3)

MODE_SEL, BYP, REF, EN, FB to

AGND (MAX77178)................................. -0.3V to (VIN3 + 0.3)

REF to GSNS............................................... -0.3V to (VIN3 + 0.3)

AGND to GSNS.....................................................-0.3V to +0.3V

AGND to PGND.....................................................-0.3V to +0.3V

ILX Current................................................................ 1250mARMS

Continuous Power Dissipation (TA = +70NC)

12-Bump, 1.75mm x 1.4mm WLP

(derate 13.7 mW/°C above +70°C)............................1096mW

Operating Temperature Range........................... -40°C to +85°C

Junction Temperature......................................................+150°C

Storage Temperature Range............................. -65°C to +150°C

Soldering Temperature (reflow).......................................+260°C

PACKAGE THERMAL CHARACTERISTICS (Note 1)

WLP

Junction-to-Ambient Thermal Resistance (qJA)...........73°C/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device

can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles

recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR /VPR and convection

reflow. Preheating is required. Hand or wave soldering is not allowed.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-

tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

ELECTRICAL CHARACTERISTICS

(VIN1 = VIN2 = VIN3 = 3.7V, VPGND = VAGND = 0V, L = 0.47µH, COUT = 4.7µF, TA = -40°C to +85°C. Typical values are at

TA = +25°C, unless otherwise noted.) (Note 3)

PARAMETER

GENERAL

IN1, IN2, IN3 Operating Voltage

IN1, IN2, IN3 Undervoltage Lockout

(UVLO) Threshold

IN1, IN2, IN3 UVLO Hysteresis

IN1, IN2, IN3 Shutdown Supply

Current

STEP-DOWN DC-DC CONVERTER

IN1, IN2, IN3 No-Load Supply

Current

Output Capacitance Required for

Stability

CONDITIONS

IN1, IN2, IN3 falling (enter power-down mode and

disable the output)

VEN = VAGND = 0V or VIN_ is

below UVLO threshold

TA = +25NC

TA = +85NC

VOUT = 0.5V, no load, skip mode operation

VOUT = 0.5V, no load, PWM operation

VOUT = 3V, no load, PWM operation

VOUT = 0.5V to VIN1, IOUT = 0A to 1A

MIN

2.5

2.10

0.1

TYP MAX UNITS

5.5

V

2.20

2.30

V

100

mV

0.1

1

FA

0.1

450

FA

3.5

mA

8

0.47

10

FF

Output Inductance Required for

Stability

VOUT = 0.5V to VIN1, IOUT = 0A to 1A

0.22

1.0

FH

Startup Time from Shutdown

From VEN = low to VEN = high, VOUT = 0.5V

30

Fs

Maxim Integrated

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