NCV7518 查看數據表（PDF） - ON Semiconductor

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NCV7518

FLEXMOS Hex Low‐side MOSFET Pre‐driver

ON Semiconductor 

NCV7518, NCV7518A

MAXIMUM RATINGS (Voltages are with respect to device substrate.)

Rating

Value

Unit

DC Supply − VLOAD

DC Supply − VCC1, VCC2, VDD

Difference Between VCC1 and VCC2

Difference Between GND (Substrate) and VSS

Drain Input Clamp Forward Voltage Transient (≤2 ms, ≤1% duty)

−0.3 to 40

V

−0.3 to 5.8

V

±0.3

V

±0.3

V

78

V

Drain Input Clamp Forward Current Transient (≤2 ms, ≤1% duty)

10

mA

Drain Input Clamp Energy Repetitive (≤2 ms, ≤1% duty)

1.56

mJ

Drain Input Clamp Reverse Current VDRNX ≥ −1.0 V

Input Voltage (Any Input Other Than Drain)

−50

mA

−0.3 to 5.8

V

Output Voltage (Any Output)

−0.3 to 5.8

V

Junction Temperature, TJ

Storage Temperature, TSTG

Peak Reflow Soldering Temperature: Lead-free 60 to 150 seconds at 217°C (Note 1)

−40 to 150

°C

−65 to 150

°C

260 peak

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. See or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

ATTRIBUTES

Characteristic

Value

ESD Capability

Human Body Model per AEC−Q100−002

Machine Model per AEC−Q100−003

Drain Feedback Pins (Note 3)

All Other Pins

≥ ±4.0 kV

≥ ±2.0 kV

≥ ±200 V

Moisture Sensitivity

(Note 2)

MSL3

Package Thermal Resistance − Still-air

Junction-to-Ambient, RqJA

Junction-to-Exposed Pad, RYJPAD

(Note 4)

(Note 5)

95°C/W

46°C/W

3.2°C/W

2. See or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

3. With GND & VSS pins tied together − path between drain feedback pins and GND, or between drain feedback pins.

4. Based on JESD51−3, 1.2 mm thick FR4, 2S0P PCB, 2 oz. signal, 20 thermal vias to 400 mm2 spreader on bottom layer.

5. Based on JESD51−7, 1.2 mm thick FR4, 1S2P PCB, 2 oz. signal, 20 thermal vias to 80 x 80 mm 1 oz. internal spreader planes.

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

VLOAD

Diagnostic References and Currents Power Supply Voltage

VDRNX

Drain Input Feedback Voltage

VCC1

Main Power Supply Voltage

VCC2

Gate Drivers Power Supply Voltage

VDD

Serial Output Driver Power Supply Voltage

VFLTREF Fault Detect Threshold Reference Voltage

VIN High Logic High Input Voltage

VIN Low Logic Low Input Voltage

TA

Ambient Still-air Operating Temperature

tRESET

Startup Delay at Power-on Reset (POR) (Note 6)

6. Minimum wait time until device is ready to accept serial input data.

MIN

7.5

−0.3

4.75

VCC1 − 0.3

3.0

0.35

2.0

0

−40

500

MAX

18.0

60

5.25

VCC1 + 0.3

VCC1

2.75

VCC1

0.8

125

−

Unit

V

V

V

V

V

V

V

V

°C

ms

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