NCP4586
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage (Note 1)
Output Voltage
VIN
7
V
VOUT
−0.3 to VIN + 0.3
V
Chip Enable Input
VCE
−0.3 to 7
V
Output Current
Power Dissipation UDFN4
Power Dissipation SC−82AB
IOUT
PD
200
mA
400
380
mW
Power Dissipation SOT23−5
420
Maximum Junction Temperature
TJ(MAX)
+150
°C
Operating Ambient Temperature
TA
−40 to +85
°C
Storage Temperature
TSTG
−55 to +125
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
THERMAL CHARACTERISTICS
Rating
Thermal Characteristics, UDFN4
Thermal Resistance, Junction−to−Air
Thermal Characteristics, SOT23−5
Thermal Resistance, Junction−to−Air
Thermal Characteristics, SC 82AB
Thermal Resistance, Junction−to−Air
Symbol
RqJA
RqJA
RqJA
Value
250
238
263
Unit
°C/W
°C/W
°C/W
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