SI7013-A20-IMR 查看數據表（PDF） - Silicon Laboratories

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SI7013-A20-IMR

I2C HUMIDITY AND TWO-ZONE TEMPERATURE SENSOR

Silicon Laboratories 

10. PCB Land Pattern and Solder Mask Design

Si7013-A20

Not

Designs

New Table 25. PCB Land Pattern Dimensions

r Symbol

mm

fo C1

2.80

E

0.50

d P1

1.40

e P2

2.60

d X1

0.30

n Y1

1.00

e Notes:

m General

1. All dimensions shown are at Maximum Material Condition (MMC). Least Material

Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.

m 2. This Land Pattern Design is based on the IPC-7351 guidelines.

o Solder Mask Design

3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the

csolder mask and the metal pad is to be 60 μm minimum, all the way around the pad.

Stencil Design

e4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should

R be used to assure good solder paste release.

5. The stencil thickness should be 0.125 mm (5 mils).

6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.

7. A 2x1 array of 0.95 mm square openings on 1.25 mm pitch should be used for the

center ground pad to achieve a target solder coverage of 50%.

Card Assembly

8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification

for Small Body Components.

Rev. 1.4

41

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