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74LV374D,118 查看數據表(PDF) - NXP Semiconductors.

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74LV374D,118 Datasheet PDF : 17 Pages
First Prev 11 12 13 14 15 16 17
NXP Semiconductors
74LV374
Octal D-type flip-flop; positive edge-trigger; 3-state
12. Package outline
DIP20: plastic dual in-line package; 20 leads (300 mil)
SOT146-1
D
L
Z
20
e
b
pin 1 index
1
A2 A
A1
wM
b1
11
ME
c
(e 1)
MH
E
10
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.30
0.53
0.38
0.36 26.92 6.40
0.23 26.54 6.22
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
2
inches 0.17
0.02
0.13
0.068 0.021 0.014 1.060
0.051 0.015 0.009 1.045
0.25
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01 0.078
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
IEC
SOT146-1
REFERENCES
JEDEC
JEITA
MS-001
SC-603
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Fig 11. Package outline SOT146-1 (DIP20)
74LV374_2
Product data sheet
Rev. 02 — 14 May 2009
© NXP B.V. 2009. All rights reserved.
11 of 17

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