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EP2C5F208C8N

Cyclone II Device Handbook, Volume 1

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Contents

Guidelines for IEEE Std. 1149.1 Boundary-Scan Testing ............................................................. 14–18

Boundary-Scan Description Language (BSDL) Support .............................................................. 14–19

Conclusion .......................................................................................................................................... 14–19

References ........................................................................................................................................... 14–19

Document Revision History ............................................................................................................. 14–20

Section VII. PCB Layout Guidelines

Revision History .................................................................................................................................. 14–1

Chapter 15. Package Information for Cyclone II Devices

Introduction .......................................................................................................................................... 15–1

Thermal Resistance .............................................................................................................................. 15–2

Package Outlines ................................................................................................................................. 15–4

144-Pin Plastic Thin Quad Flat Pack (TQFP) – Wirebond ........................................................ 15–4

208-Pin Plastic Quad Flat Pack (PQFP) – Wirebond ................................................................. 15–7

240-Pin Plastic Quad Flat Pack (PQFP) ....................................................................................... 15–9

256-Pin FineLine Ball-Grid Array, Option 2 – Wirebond ....................................................... 15–11

484-Pin FineLine BGA, Option 3 – Wirebond .......................................................................... 15–13

484-Pin Ultra FineLine BGA – Wirebond ................................................................................. 15–15

672-Pin FineLine BGA Package, Option 3 – Wirebond ........................................................... 15–17

896-Pin FineLine BGA Package – Wirebond ............................................................................ 15–19

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Cyclone II Device Handbook, Volume 1

Altera Corporation

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