NXP Semiconductors
9. Package outline
PMBFJ108; PMBFJ109; PMBFJ110
N-channel junction FETs
Plastic surface-mounted package; 3 leads
SOT23
D
B
E
A
X
3
1
e1
bp
e
2
wM B
HE
vM A
A
A1
Q
c
Lp
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max.
bp
c
D
E
e
e1
HE
Lp
Q
v
w
mm
1.1
0.9
0.1 0.48 0.15 3.0
0.38 0.09 2.8
1.4
1.2
1.9
0.95
2.5
2.1
0.45 0.55
0.15 0.45
0.2
0.1
OUTLINE
VERSION
IEC
SOT23
Fig 3. Package outline.
PMBFJ108_109_110
Product data sheet
REFERENCES
JEDEC
JEITA
TO-236AB
EUROPEAN
PROJECTION
ISSUE DATE
04-11-04
06-03-16
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 20 September 2011
© NXP B.V. 2011. All rights reserved.
5 of 9