MSC8122TVT4800V(2006) 查看數據表（PDF） - Freescale Semiconductor

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MSC8122TVT4800V
(Rev.:2006)

Quad Core 16-Bit Digital Signal Processor

Freescale Semiconductor 

Packaging

3.2 MSC8122 Package Mechanical Drawing

Notes:

1. All dimensions in millimeters.

2. Dimensioning and tolerancing

per ASME Y14.5M–1994.

3. Features are symmetrical about

the package center lines unless

dimensioned otherwise.

4. Maximum solder ball diameter

measured parallel to Datum A.

5. Datum A, the seating plane, is

determined by the spherical

crowns of the solder balls.

6. Parallelism measurement shall

exclude any effect of mark on

top surface of package.

7. Capacitors may not be present

on all devices.

8. Caution must be taken not to

short capacitors or exposed

metal capacitor pads on

package top.

9. FC CBGA (Ceramic) package

code: 5238.

FC PBGA (Plastic) package

code: 5263.

10.Pin 1 indicator can be in the

form of number 1 marking or an

“L” shape marking.

Figure 3-3. MSC8122 Mechanical Information, 431-pin FC-PBGA Package

3-20

MSC8122 Technical Data, Rev. 13

Freescale Semiconductor

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